Samsung Electronics will introduce a foundry process (semiconductor batch production) 1.4 nanometers (nm, 1 nm is 1 billionth of a meter) in 2027. The strategy is to catch up with TSMC, the leader, by increasing the number of customers with technology ‘supergap’.
At the ‘Samsung Foundry Forum’ held at the Signia Hotel in San Jose, USA on the 3rd (local time), CEO Si-young Choi of Samsung Electronics’ foundry division announced, “We will introduce a 2nm process in 2025 and a 1.4 process nm in 2027.” Samsung Electronics is the first to announce the timing of the introduction of the 1.4nm process.
Foundry leader TSMC formalized the development of the 1.4nm process in May, but did not reveal a specific timetable. The semiconductor industry expects mass production to be between 2027 and 2028. Samsung Electronics took a step ahead of TSMC by publishing a detailed development roadmap from 2nm to 1.4nm.
Samsung Electronics plans to raise the share of sales in areas such as high-performance computing (HPC) and automotive semiconductors to ‘more than 50%’ in order to break away from the semiconductor-centric sales structure for smart phones.
At the same time, the company plans to triple its current production capacity by 2027 by adopting a “shell-first” strategy that builds factories first and accepts customers. Meanwhile, the line was operated according to demand after the customer placed an order, but in the future, it means that the line will be made first to receive customers.
Silicon Valley = Reporter Ki-Yeol Seo philos@hankyung.com
