ASML to Establish New Technical Support Base in Hokkaido, Japan for Rapidus Collaboration
In a recent development, ASML, a prominent Dutch semiconductor manufacturing equipment manufacturer, has announced its plans to construct a new technical support base in Hokkaido, Japan by the second half of 2024. This move aims to provide assistance to the Japanese foundry company Rapidus in their quest to mass produce cutting-edge semiconductors.
Rapidus, driven to manufacture the most advanced semiconductors, will receive support from ASML in terms of factory construction and maintenance inspections. In addition, ASML plans to increase the number of domestic personnel in Japan by approximately 40% by 2028.
Undoubtedly, ASML holds a leading position as a provider of lithography equipment, playing a pivotal role in key semiconductor manufacturing processes. Moreover, it is the sole producer of extreme ultraviolet (EUV) lithography machines, an essential tool for the mass production of 5-7nm advanced semiconductors. Consequently, ASML’s support becomes indispensable for local Japanese semiconductor manufacturers.
The technical support base will be situated in Chitose City, Hokkaido, with around 50 technicians tasked with installing EUV lithography equipment on the semiconductor trial production line built by Rapidus. Their responsibilities will extend to assisting with construction inspections and factory maintenance, thus ensuring seamless operations.
Furthermore, reports suggest that other major players in the semiconductor industry are also making moves in Japan. Applied Materials, a renowned US company, plans to increase its personnel in Japan by 60% in the coming years, while Lam Research is contemplating the establishment of a new facility in Hokkaido.
It is noteworthy that Rapidus, founded in August 2022, receives joint funding from eight prominent Japanese companies, including Toyota, Sony, NTT, NEC, SoftBank, Denso, Kioxia, and Mitsubishi Bank UFJ, amounting to an investment of 7.3 billion yen. The Japanese government has also provided a research and development subsidy of 70 billion yen. With these resources, Rapidus aims to install chip equipment and commence trial production by December 2024, with the ultimate goal of mass producing 2nm chips within four years.
In conclusion, ASML’s decision to establish a technical support base in Hokkaido reaffirms its commitment to collaborating with Rapidus in the pursuit of advanced semiconductor production. This development, along with other companies’ increased presence in Japan, hints at the region’s growing significance in the global semiconductor industry.
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IT House reported on September 27, according to Nikkei News, that ASML, a major Dutch semiconductor manufacturing equipment manufacturer, will build a new technical support base in Hokkaido, Japan, by the second half of 2024.
According to reports, Japan’s Rapidus Company is striving to mass produce the most advanced semiconductors, and ASML will provide assistance to Rapidus in factory construction and maintenance inspections, and will increase Japan’s domestic personnel by 40% by around 2028.
ASML is a world leader in lithography equipment responsible for key semiconductor manufacturing processes, and is the only manufacturer in the world capable of producing extreme ultraviolet (EUV) lithography machines. EUV is the tool needed for mass production of 5-7nm advanced semiconductors, so for local Japanese semiconductors, ASML support is essential.
ASML will build a technical support base around Chitose City, Hokkaido, with approximately 50 technicians installing EUV lithography equipment on the semiconductor trial production line built by Rapidus to provide support with construction inspections and factory maintenance.
The report also said that US Applied Materials will also increase its personnel in Japan by 60% in the next few years. The American Lam Research Company (LamResearch) is considering building a new facility in Hokkaido.
IT Home Note: Rapidus was founded in August 2022. It is jointly funded by 8 Japanese companies including Toyota, Sony, NTT, NEC, SoftBank, Denso, Kioxia, and Mitsubishi Bank UFJ, with an investment of 7.3 billion yen (about now). 358 million yuan), and the Japanese government also provided a subsidy of 70 billion yen (currently about 3.437 billion yuan) as a research and development budget. The company plans to install chip equipment and start trial production in December 2024, with the aim of mass producing 2nm chips within 4 years (2028 at the latest). Return to Sohu to see more
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