Packaging factory Lingsheng (2369-TW) held a legal meeting today (25). General Manager Cai Zesong said that as the wafer shortage continues to 2023, before the supply chain is completely unraveled, the supply of wafers and packaging materials Still quite nervous, coupled with the weakening of long-term and short-term materials, will bring opportunities for the company, optimistic about next year’s demand, and will strengthen its investment in the third-generation semiconductor field.
Cai Zesong said that most of the production capacity of the four major product lines this year has been laid out, and next year’s capital expenditure will focus on special process requirements, such as third-generation semiconductors and automotive products. Chief Financial Officer Lai Mingwei also added that this year’s capital expenditure will be about 1 billion. As the depreciation period of old equipment expires one after another, the depreciation expenses next year will be equivalent to this year.
Cai Zesong pointed out that Lingsheng had focused on the third-generation semiconductor packaging process in the early days, and some equipment has commonality with existing processes. As the third-generation semiconductor market gradually expands, high-precision equipment still needs to be added to meet the needs of future mass production. .
In response to the current market conditions, Cai Zesong said that Lingsheng’s four major products include power management chips (PMIC), Flash Memory, MEMS micro-electromechanical devices, and optical sensing components. In the quarter, due to the impact of long and short materials, application end, and market demand adjustments, some products of Lingsheng have also been felt, but the overall impact is not significant.
In the future, Lingsheng will continue to strengthen supply chain management to ensure that the source of supply is safe. With the development of 5G and WiFi 6, the demand for AI, Metaverse and other products will increase. At the same time, it will also continue to develop sensing component packaging for mobile devices. , The company has seen the demand for the next generation of new products.
