Samsung Electronics Holds ‘Samsung Tech Day 2022’ in Silicon Valley, USA – Samsung Semiconductor Newsroom

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Samsung Electronics held ‘Samsung Tech Day 2022’ in Silicon Valley, USA on the 5th (local time) and unveiled next-generation semiconductor solutions and roadmaps.

‘Samsung Tech Day’, which started in 2017, is a place to showcase Samsung Electronics’ next-generation semiconductor technology, and this event was held offline for the first time in three years since 2019.

This year’s ‘Samsung Tech Day’ was held with about 800 people in attendance, including global IT companies, analysts, media, etc., including the president of the memory business division of Samsung Electronics, Lee Jung-bae, the president of the system business division of LSI Park Yong-in , and Americas general manager Jeong Jae-heon.

[ 시스템 반도체 ]

Samsung Electronics announced this morning that it will be reborn as a ‘fabless integrated solution’ by maximizing synergy between system semiconductor products.

Samsung Electronics has a portfolio of around 900 system semiconductors, including SoC (System on Chip), image sensor, modem, DDI (Display Driver IC), power semiconductor (PMIC, Power Management IC), security solution, and so forth. We intend to provide an integrated solution optimized for customer needs as a ‘Platform Solution’.

Park Yong-in, president of LSI System Business Division, said, “In the age of the 4th industrial revolution, where things must learn and judge like humans, the importance of system semiconductors that play the role of the human brain, the heart , neural network, and vision more than ever.” Samsung Electronics will become a ‘fabless integrated solution’ leading the era of the 4th industrial revolution by organically merging the main technologies of various products such as SoC, image sensor, DDI, and modem.”

□ Draw a picture of the semiconductor future of a system that performs functions close to a human level


Samsung Electronics anticipates the need for Hyper-Intelligence, Hyper-Connectivity, and Hyper-Data in the era of Industrial Revolution 4. It announced that it would develop a state-of-the-art semiconductor system.

At SoC, we intend to improve the performance of large IPs such as NPU (Neural Processing Unit) and modem, while also strengthening the competitiveness of SoC core by developing industry-leading CPUs and GPUs in collaboration with global partners.

In addition, we plan to develop an ultra-high-pixel image sensor close to the human eye, and a sensor that can detect and operate the human senses (taste, smell, hearing, sight and touch).

□ Reveal next-generation system semiconductor products such as 5G modem, vehicle SoC, and DDI


At this event, Samsung Electronics showcased its advanced system semiconductor products through a booth display.

New products such as next-generation vehicle SoC ‘Exynos Auto V920’, 5G modem ‘Exynos 5300 Modem’, QD (Quantum Dot) OLED DDI, premium mobile AP ‘Exynos 2200’, industry’s smallest 2 Billion pixel image sensor ‘ISOCELL HP3 Unveiled ‘ and fingerprint authentication IC products for ‘biometric authentication card’ as well.

‘Exynos 2200’ is a product to which the state-of-the-art 4-nano EUV process, the latest mobile technology, and next-generation GPU and NPU are applied, providing a new level of user experience in various fields such as games, image processing, and AI. ISOCell HP3 with a pixel size of 0.56㎛ reduces the pixel size by 12% compared to existing products, making it possible to reduce the size of the camera module for mobile devices by up to 20%.

The fingerprint authentication IC is the first in the industry to integrate the hardware security chip (SE, Secure Element), fingerprint sensor, and security processor that Samsung Electronics installed on each card into a single IC chip, improving convenience credit card users.

Meanwhile, Samsung Electronics drew the attention of attendees by holding a demonstration session where they could directly experience the clarity of photos taken through a 200-megapixel image sensor. The implementation of the fingerprint security function of the fingerprint authentication IC was also presented through simulation.

[ 메모리 반도체 ]


At the memory semiconductor session held in the afternoon, Samsung Electronics unveiled its next-generation product roadmap, including ‘5th generation 10-nano-class (1b) DRAM’ and ‘8th / 9th generation V-NAND’, and creating memory through differentiation. solutions and market creation It said it would continue to maintain its technological leadership.

“The total memory storage capacity that Samsung Electronics has created over the past 40 years has exceeded 1 trillion gigabytes (GB), half of which have been created in the past three years, so we are in the midst of a digital transformation which is changing rapidly. , “said Lee Jeong-bae, head of Samsung Electronics’ memory business division. Transformation),” he said.

Samsung Electronics intends to improve quality satisfaction by overcoming technological limitations and develop into a sustainable business by contributing to the entire industry through a new business model that grows together with customers.

□ The evolution of data intelligence with next generation solutions such as ‘5th generation 10-nano-class DRAM’


Samsung Electronics has unveiled future DRAM solutions that will advance data intelligence and various DRAM technologies to overcome the limitations of process miniaturization.

Samsung Electronics is developing next-generation DRAM technology that can support various system architectures such as HBM-PIM (Processing-in-Memory), AXDIMM (Acceleration DIMM), and CXL (Compute Express Link) to cope with the explosive use of data that is increasing. He announced that he would cooperate with global IT companies for growth.

In addition, we plan to confirm our leadership in the premium DRAM market by releasing next-generation products such as high-capacity 32Gb DDR5 DRAM for data centers, low-power 8.5Gbps LPDDR5X DRAM for mobile use, and high-speed 36Gbps GDDR7 DRAM. for graphics in a timely manner. Samsung Electronics plans to mass produce ’10-nano-class 5th generation DRAM’ in 2023, while overcoming the limitations of process miniaturization by applying new process technologies such as the High-K Metal Gate process and next-generation product structure. .

□ Development of ‘1,000-layer V-NAND’ in 2030… Change market pattern with new technology


Samsung Electronics announced that it will introduce a new paradigm with innovative NAND technology, such as the mass production of 9th generation V-NAND by 2024 and the development of 1,000-layer V-NAND by 2030.

Samsung Electronics plans to mass produce the world’s highest capacity 8th generation V-NAND-based 1Tb TLC (Triple Level Cell) products this year.

In addition, TLC’s 8th generation V-NAND 512Gb product was unveiled, which improved the number of bits stored per unit area by 42% compared to the 7th generation. This is an industry leading 512Gb TLC product.

Samsung Electronics plans to expand the QLC (Quadruple Level Cell) ecosystem to respond to the diverse needs of customers who require large capacity data, such as data centers and artificial intelligence, and improve power efficiency to contribute to customers’ eco-friendly management.

□ Unveil solutions that will accelerate innovation, such as automotive memory and next-generation storage


Since Samsung Electronics first entered the automotive memory market in 2015, it has continued to grow rapidly. By supplying the best possible memory solutions for autonomous driving (AD), advanced driver assistance systems (ADAS), infotainment (IVI), telematics, etc., we aim to achieve the No. 1 position in the automotive memory market by 2025.

In addition, in a situation where the need for high-performance memory is increasing due to the development of vehicles and electrification, Samsung Electronics announced that it will provide next-generation memory solutions such as LPDDR5X, GDDR7, and Shared Storage to achieve mobility innovation. .

Samsung Electronics, which has a diverse line of storage from enterprise to client, mobile, vehicle, and brand, also offers SSD ‘PM9C1a’ with HMB (Host Memory Buffer) technology that connects directly to the DRAM that has to install in the PC without the DRAM installed inside the SSD.

The development of computer storage with improved internal SSD computation is also ongoing. We will create a sustainable future through high performance, low power products optimized for artificial intelligence.

Meanwhile, Samsung Electronics opened the ‘Samsung Memory Research Center (SMRC)’, which provides customers with an optimized environment for developing/evaluating next-generation memory solutions, and collaborates with Red Hat and Google Cloud. We plan to expand the SMRC sequentially to other regions.


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