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Tongfu Microelectronics: The company has established a stable strategic partnership with AMD through “joint venture + cooperation”.


Every time an AI Express is sent, an investor asks a question on the investor interactive platform: The company continues to increase by private placementsemiconductorPackaging and testing capacity, what is the market judgment of the board secretary’s continuous fixed increase? What is the expected payback period for the added capacity? Is there a risk that the investment has not been recovered and the foreign major customer AMD will cancel the cooperation? In addition, is there any risk of being sanctioned by the US in cooperation with major US customers?

  Tongfu Microelectronics(002156.SZ) stated on the investor interaction platform on January 26 that with the continuous development of technologies such as 5G communication networks, artificial intelligence, automotive electronics, intelligent mobile terminals, and the Internet of Things, the demand for integrated circuits continues to expand;semiconductorUnder the background of the migration of the industrial chain to mainland China, with the trend of domestic terminal manufacturers gradually shifting the supply chain to the country, domestic packaging and testing enterprises are facing good development opportunities. Based on the above background, the company plans to raise funds through fixed increase, which will be used for the construction of raised investment projects to further enhance the company’s production capacity and comprehensive competitiveness in the field of integrated circuit packaging and testing. The investment return cycle of new projects, please pay attention to the implementation progress of fundraising projects disclosed by the company later. The company has established a stable strategic partnership with AMD through the “joint venture + cooperation” approach, and there is no risk of lifting the cooperation and sanctions.

(Article source: Daily Economic News)


Article source: Daily Economic News

Responsible editor: 91

Original title: Tongfu Microelectronics: The company has established a stable strategic partnership with AMD through “joint venture + cooperation”

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