Wafer foundry UMC (2303-TW) is actively accelerating the layout of compound semiconductors and is optimistic about the demand prospects. It has established a technology platform with its approximately 80% shareholding subsidiary, Lianying Optoelectronics, and cooperated with the Belgian Microelectronics Research Center (IMEC) for technology research and development. In the initial stage, the 6-inch GaN (Gallium Nitride) process will be used, and customers will start to design and import next year.
UMC Associate Zheng Ziming attended the “SEMI Talks Leadership Dialogue” at the SEMICON Taiwan 2021 Compound Semiconductor Special Exhibition today. In an interview after the meeting, he said that there are currently few GaN overall solution providers and the technology platform is being built. After completion, the platform will be deployed. Open to design companies to come in and use.
Zheng Ziming pointed out that the platform’s main applications include power electronics, radio frequency, microwave, etc. Next year, it will provide driver IC customer design introduction. Initially, GaN will be used to cut in. After a certain degree of maturity, SiC will begin to be inked. In the future, there will also be opportunities from 6 inches to 8 inches. go.
Liu Qidong, Chief Financial Officer of UMC, also explained that the platform is cooperating with UMC through UMC’s R&D. The leader is UMC, and the research and development is a joint cooperation between the two parties.
