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Upgraded cooling solution, Thermaltake booth – Computex 2033 > Review

Recently, the polarization of the computer system has become fixed, with the extreme high-end and the lowest cost-effective computer. With AMD Ryzen 7000X 3D processor, Nvidia GeForce RTX 4090, and Intel Core i9 13900K processor released from last year to this year, high-end users are growing significantly. Because of these high-end computer peripherals, the market growth rate of my own unique computer case with high performance cooling solution is continuously increasing. In particular, those who use high-end specifications do not hesitate to buy expensive peripherals because they use the highest priced products such as processors and graphics cards. And along with it, the market for “special brand fans”, which shows a slightly different growth this year, is growing. From that perspective, ThermalTake (ThermalTake, TT) sells very high-end peripherals, and its market growth has been steady over the past period. It can be said that the fan base for Thermaltake in Korea is growing thicker.



ThermalTake Booth – Computex 2033




▲ Kenny Lin, founder and current CEO of Thermaltake

Thermaltake participated in Computex 2033 with a rather large booth, and in particular, the current CEO, the founder, directly explained and demonstrated the new Thermaltake products released through the opening ceremony. And we invited famous overclockers and PC mod makers around the world to host many offline booths.





▲ Display systems were displayed so that various Thermaltake products that were already on sale could be quickly viewed.





▲ TOUGHRAM, an overclocking tuning RAM released and sold by Thermaltake, was also showcased and demonstrated.





▲ In this Computex 2033, Thermaltake expanded the range of choices of existing products by adding “Tower Chassis Green Color 200, Broad Chassis Green Color 300 TG ARGB” to target user customization preferences.


▲ An option has been added so that the company’s LCD module can be installed and used on existing products involving thermal take-off and water cooling.






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