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Texas ⁤Fab‌ to Lead the ⁣Way in Advanced Chip Stacking

A 1980s-era semiconductor fab in Austin, Texas, is undergoing a notable transformation. Now known as ⁣the Texas Institute for Electronics (TIE),it’s being equipped to become the world’s sole advanced packaging plant dedicated to 3D heterogeneous integration (3DHI)-the process of stacking chips made from diverse materials,including both silicon and‍ non-silicon compounds.

This fab is central to DARPA’s Next-Generation Microelectronics ⁤Manufacturing (NGMM) program. “NGMM is focused ⁤on a‌ revolution in microelectronics through‌ 3D heterogeneous integration,” stated Michael Holmes, managing ⁣director of the program.

Stacking‍ silicon chips within a single‌ package already ​enhances the performance of ‍some of⁢ the most advanced processors available. However, DARPA anticipates ​that silicon-on-silicon stacking will yield ⁢a performance increase of⁤ up to 30x compared to traditional 2D integration.More considerably, utilizing a combination of materials-such as gallium nitride, silicon carbide, and othre semiconductors-coudl possibly deliver a 100x performance ⁣boost, as Holmes revealed‍ at the NGMM Summit.

The new fab will provide a domestic location for⁣ prototyping‌ and manufacturing ⁢these ⁣innovative stacked ⁣chips. Startups, many of whom were present at the launch event, are seeking ⁤a facility to develop and produce ideas that​ are too unconventional for conventional foundries-aiming‌ to overcome the lab-to-fab gap ⁤that often hinders hardware ​startups.

The state of⁢ Texas is investing $552 million ⁤in the fab and its associated programs, complemented by $840 million from ​DARPA. Following ⁢the completion of NGMM’s ⁤five-year mission, the fab is projected to operate as a self-sustaining business. “We‌ are, frankly, a startup,” acknowledged Dwayne LaBrake, CEO of TIE.”We have more runway than‌ a typical startup,‌ but we have to stand on our own.”

starting ‌up a 3DHI Fab

Progress is ​already underway, with‍ IEEE Spectrum observing numerous chip manufacturing and testing tools being installed and a growing team of engineers and⁢ technicians.⁢ TIE anticipates having all equipment in place by the first quarter of 2026.

equally​ crucial is establishing a reliable and predictable manufacturing process​ for foundry customers,a challenge ‍TIE officials recognize.