Cache Clash: AMD’s 3D V-Cache Takes a Stunning U-Turn – How Does the Ryzen 7 9800X3D Stack Up Against Its Predecessors

AMD Ryzen 9000X3D processor debuts

The first Zen 5 processor with 3D V-Cache, Ryzen 7 9800X3D, is officially launched! AMD was originally worried that Intel’s Core Ultra 200S would perform well in gaming performance, so it launched the Ryzen 7 9800X3D early. Unexpectedly, Intel’s new generation CPU performed so poorly in gaming performance, making it difficult to launch the Ryzen 7 9800X3D early. It makes sense that AMD has raised the price from US$449 to US$479 without any pressure. Anyway, it has no rivals and can clear the inventory of the previous generation Ryzen 7000X3D.

Like Ryzen 7000X3D, Ryzen 7 9800X3D processor also uses second-generation 3D V-Cache technology. Compared with the first generation, the bandwidth has been increased from 2TB/s to 2.5TB/s. The 3D V-Cache Die and CCD Die are fixed through Direct Copper-to-Copper Bond technology, and the signals are interconnected through TSV silicon through hole technology. . Therefore, there is no difference in the raw performance of 3D V-Cache between 7000X3D and 9000X3D. The main reason lies in the packaging location of the 3D V-Cache Die.

Previously, the AMD 3D V-Cache chip was stacked on top of the Zen 3 and Zen 4 CCD. Since this L3 SRAM thin layer is very fragile, part of the heat of the CCD chip needs to pass through it before it can be transferred to the IHS heat dissipation cover. Therefore, AMD The clock and voltage of the CCD itself have to be reduced to avoid overheating and damaging the 3D V-Cache chip. This is why AMD officials have not provided overclocking functions on the X3D model. They are worried that players will overheat the 3D V-Cache chip after overclocking the voltage. .

However, AMD has learned a lesson this time. Ryzen 9000X3D stacks the 3D V-Cache chip in reverse under the Zen 5 CCD. The heat of the Zen 5 CCD can be directly transferred to the IHS heat dissipation cover without going through the 3D V-Cache, so AMD does not need to Don’t worry about Ryzen 9000X3D heat dissipation anymore. Without this thin layer of L3 SRAM barrier, the heat transfer efficiency of Ryzen 9000X3D is increased by 46%. As the CPU temperature is significantly reduced, Ryzen 9000X3D can maintain higher single-threaded and multi-threaded clock speeds.

Three major advantages of 3D V-Cache reversed

Although Ryzen 9800X3D uses the same second-generation 3D V-Cache technology as the previous generation 7800X3D, improvements in packaging technology have brought three major advantages:

◾Re-engineered

The CCD of Ryzen 9800X3D and the IHS heat dissipation cover are no longer blocked by the 3D V-Cache Die and filler. Officials claim that the heat transfer efficiency has increased by 46%, significantly improving the heat dissipation performance. At the same time, Tjmax has also increased from 89°C to 95°C. C.

◾Faster

After the 3D V-Cache chip is stacked under the Zen 5 CCD, the base clock of Ryzen 9800X3D is increased by 500MHz compared to the previous generation 7800X3D, while the maximum acceleration clock is also increased by 200MHz, and it can maintain higher single-thread and Multi-threaded clock speed.

◾Full overclockability

Ryzen 9800X3D has become the first X3D model to support unlocked multiplier function, which means that players can overclock the processor as long as they have a good enough radiator, and the clock and voltage limits are the same as ordinary Ryzen 9000 processors.