Fujifilm Holdings Corporation is investing approximately 1,800万米ドル, or about 30億円, to install new

Fujifilm Holdings Corporation is investing approximately 1,800万米ドル, or about 30億円, to install new production equipment for chemical mechanical planarization slurries at its Mesa facility in Arizona, nikkei.com reported on October 14, 2026. The investment aims to expand the company’s semiconductor materials business and establish a stable supply chain for advanced semiconductor manufacturing processes.

Expanding Arizona Production and New Equipment

The capital expenditure will upgrade production capacity for copper wiring CMP slurries at the Mesa site, which serves as Fujifilm’s core production and development hub for these materials. In addition to copper wiring products, the company will install brand-new equipment designed to handle high-mix production of CMP slurries tailored for diverse semiconductor manufacturing processes, including advanced packaging applications. These new lines will directly connect the global research and development output from the Mesa facility’s research center to full-scale manufacturing, allowing for rapid commercialization.

Meeting Accelerated Semiconductor Demand

Surging artificial intelligence demand is driving rapid growth in the advanced semiconductor market, creating an increased need for the specialized slurries required to manufacture logic and memory chips. Copper wiring CMP slurries, in which Fujifilm holds a global top market share, are seeing particularly heavy demand. Major chipmakers and Asia-based manufacturers operating new fabrication plants in the United States continue to invest heavily, pointing to sustained demand growth across the region.

Targeting Front-End and Back-End Processes

The upgraded and newly established equipment will target both front-end and back-end manufacturing steps. Beyond back-end-of-line copper wiring applications, the production lines will support front-end-of-line and middle-of-line requirements, alongside advanced packaging techniques such as hybrid bonding.

Scheduled Equipment Operation in Arizona

The newly installed production equipment at the Mesa site is scheduled to begin operating in 2027, securing a supply framework capable of absorbing mid-to-long-term demand increases for advanced chip materials.