Intel AI Chip Packaging | Advanced Tech Explained
- Intel is developing new chip packaging technology to create larger processors for artificial intelligence, the company announced this week at the IEEE Electronic Components and Packaging Technology Conference...
- As Moore’s Law slows, manufacturers are seeking ways to increase silicon area for GPUs and data center chips to meet growing AI demands.
- Intel's innovations address limitations on silicon density within a single package.
Intel is revolutionizing AI with advanced chip packaging! Breaking through silicon size constraints, Intel’s new technology creates larger processors tailor-made for artificial intelligence.The innovation uses advancements like Embedded Multi-die Interconnect bridge (EMIB-T) to enhance silicon connections and improve thermal control, vital for boosting AI performance. As Moore’s Law tapers, Intel’s upgrades are crucial to powering the next generation of GPUs and data center chips. Through this packaging breakthrough, Intel aims to integrate over 10,000 square millimeters of silicon. News Directory 3 knows that these developments will help Intel Foundry compete with TSMC. With these advancements, Intel is set to redefine high-performance computing. Discover what’s next in the exciting world of AI chip design!
Intel Unveils Advanced Chip Packaging for Larger AI Processors
Updated June 9, 2025
Intel is developing new chip packaging technology to create larger processors for artificial intelligence, the company announced this week at the IEEE Electronic Components and Packaging Technology Conference (ECTC).
As Moore’s Law slows, manufacturers are seeking ways to increase silicon area for GPUs and data center chips to meet growing AI demands. The size of a single silicon chip is capped around 800 square millimeters. Advanced packaging technologies, which integrate multiple silicon pieces, offer a solution.
Intel’s innovations address limitations on silicon density within a single package. these include enhancements to interconnect technology, improved silicon-to-substrate bonding, and a system for expanding package size and heat removal. The combined technologies allow integration of over 10,000 square millimeters of silicon in a package exceeding 21,000 square millimeters.
One key advancement is the evolution of Embedded Multi-die Interconnect Bridge (EMIB) technology. Rahul Manepalli, Intel vice president of substrate packaging technology, said the EMIB-T technology includes vertical copper connections called through-silicon vias (TSVs).These TSVs provide direct power connections to chips, reducing power loss. EMIB-T also incorporates a copper grid to minimize power noise.
Manepalli said that with EMIB-T, customers could connect silicon equivalent to more than 12 full-size silicon dies in a single package using 38 or more EMIB-T bridges.
Intel also reported progress in low-thermal-gradient thermal compression bonding.This refines the process of attaching silicon dies to substrates, managing thermal expansion mismatches for more reliable, large-scale substrates. This technology can also increase connection density to EMIB.
To manage the increased heat from larger silicon assemblages, Intel developed a multi-part integrated heat spreader. This design maintains flatness at high temperatures, improving reliability, according to Manepalli.
What’s next
While the technologies are still in R&D, Intel’s advanced chip packaging solutions are expected to debut in the coming years. This is crucial for Intel Foundry to compete with TSMC’s packaging expansion.