Samsung Electronics announced it has begun mass production and shipment of its High Bandwidth Memory 4 (HBM4) chips, marking a significant step in the ongoing race to provide memory solutions for the rapidly expanding artificial intelligence market. The company’s chief financial officer, Mark Murphy, confirmed the shipments are already underway to customers.
This move comes as demand for HBM, crucial for accelerating AI workloads, is projected to surge. The HBM market is forecast to grow by 58% in , reaching $54.6 billion, according to industry analysis. Samsung’s entry into HBM4 production is particularly noteworthy as it represents a recovery following challenges experienced during the HBM3E cycle.
A New Architecture for AI Acceleration
HBM4 represents a fundamental shift in high-bandwidth memory technology, moving beyond the incremental improvements seen in previous generations. The new standard boasts a 2048-bit interface, a substantial increase designed to overcome the “memory wall” that has historically limited the performance of large language models and other AI applications. This increased bandwidth is critical for handling the ever-growing data demands of advanced AI systems.
Samsung’s HBM4 modules are currently achieving data transfer speeds of up to 11.7 Gbps, exceeding the previously established benchmark of 10 Gbps. This performance leap is attributed to the utilization of a sixth-generation 10nm-class (1c) DRAM process, coupled with in-house 4nm foundry logic die. The combination of these technologies allows for faster data access and improved energy efficiency.
Strategic Wins with NVIDIA and AMD
A key factor in Samsung’s success with HBM4 is securing qualification from both NVIDIA and Advanced Micro Devices (AMD). This validation ensures that Samsung’s HBM4 chips will be compatible with NVIDIA’s upcoming “Rubin” series and AMD’s “Instinct MI400” series of AI accelerators. These accelerators are expected to drive the next wave of innovation in generative AI, and Samsung’s role as a supplier positions the company favorably within the AI ecosystem.
The competition in the HBM4 market is intensifying. SK Hynix, a major player in the HBM space, stated in January that it intends to maintain its “overwhelming” market share in HBM4, as volume production ramps up. SK Hynix is also expanding its production capacity, with plans to open a new cleanroom as early as March to accommodate increased demand.
The Broader Implications for the Memory Market
The arrival of HBM4 signals a broader trend towards specialized memory solutions designed to meet the unique demands of AI. Traditional DRAM and NAND flash memory are often insufficient for the high-bandwidth, low-latency requirements of AI workloads. HBM, with its stacked architecture and wide interface, offers a significant performance advantage in these applications.
NVIDIA’s strategy of diversifying its HBM supply chain to include both Samsung and SK Hynix, and potentially Micron Technology, underscores the critical importance of securing a stable and reliable supply of HBM. The insatiable global demand for AI hardware has created a competitive landscape for memory manufacturers, and NVIDIA’s approach aims to mitigate potential supply chain disruptions.
Samsung’s return to prominence in the HBM market is a positive development for the company, which faced challenges during the HBM3E cycle. The successful launch of HBM4 demonstrates Samsung’s ability to innovate and compete in this strategically important segment of the memory market. The company’s investment in advanced DRAM and foundry technologies is paying dividends, allowing it to deliver cutting-edge memory solutions to leading AI hardware developers.
The increased competition among HBM manufacturers is expected to drive further innovation and cost reductions, ultimately benefiting AI developers and end-users. As AI continues to permeate various industries, the demand for high-performance memory solutions like HBM4 will only continue to grow, making this a crucial area to watch in the coming years.
