SK ⁢Hynix to Showcase AI Memory Solutions at TSMC’s OIP 2024

South Korean chip maker SK Hynix Inc. is set to participate ⁤in the Open Innovation Platform ⁢(OIP) Ecosystems Forum hosted by Taiwan’s TSMC, ‌the world’s largest‍ foundry ⁣company, to showcase its ‍AI memory⁢ solutions.

TSMC will host the OIP Ecosystem⁤ Forum 2024 next Wednesday at the Santa Clara Convention ‌Center in ⁢California,⁣ where it will discuss the latest technologies and⁣ products ⁢with⁣ its partners and clients.

About the OIP Ecosystem Forum

Since 2008, TSMC has​ supported⁣ the OIP with intellectual property (IP) companies, electronic design ‌automation (EDA) companies, and design houses, providing leading companies with semiconductor designs optimized for ⁣TSMC’s production process.

This ⁢Year’s Event Highlights

At this year’s event, TSMC will highlight how AI is transforming chip design and discuss the⁤ latest ‍developments in 3D integrated circuit (IC)⁢ system design. There will also be over 50 technical​ presentations and 47​ exhibitions ​from⁣ OIP ecosystem partners.

SK ‌Hynix’s Participation

TSMC partner SK Hynix will present joint research on 2.5D systems-in-packages to improve the quality‍ and⁢ reliability of high-bandwidth memory (HBM). The company will also ⁤have a⁣ booth showcasing its ‍latest AI memory products, including⁣ the fifth generation HBM3E, LPCAMM2, and GDDR7.

Other ‍Notable Participants

Representatives from companies such⁣ as Nvidia, ⁤Microsoft, AMD, Arm, Cadence and Synopsys will give technical presentations.

Global Participation

The OIP Forum will‍ be held in ‍six regions, including⁣ the United States, Japan, Taiwan, China, Europe, ​and Israel, and participation is expected from 750 companies and over ​6,000 attendees.