SK Hynix to Showcase AI Memory Solutions at TSMC’s OIP 2024

South Korean chip maker SK Hynix Inc. is set to participate in the Open Innovation Platform (OIP) Ecosystems Forum hosted by Taiwan’s TSMC, the world’s largest foundry company, to showcase its AI memory solutions.

TSMC will host the OIP Ecosystem Forum 2024 next Wednesday at the Santa Clara Convention Center in California, where it will discuss the latest technologies and products with its partners and clients.

About the OIP Ecosystem Forum

Since 2008, TSMC has supported the OIP with intellectual property (IP) companies, electronic design automation (EDA) companies, and design houses, providing leading companies with semiconductor designs optimized for TSMC’s production process.

This Year’s Event Highlights

At this year’s event, TSMC will highlight how AI is transforming chip design and discuss the latest developments in 3D integrated circuit (IC) system design. There will also be over 50 technical presentations and 47 exhibitions from OIP ecosystem partners.

SK Hynix’s Participation

TSMC partner SK Hynix will present joint research on 2.5D systems-in-packages to improve the quality and reliability of high-bandwidth memory (HBM). The company will also have a booth showcasing its latest AI memory products, including the fifth generation HBM3E, LPCAMM2, and GDDR7.

Other Notable Participants

Representatives from companies such as Nvidia, Microsoft, AMD, Arm, Cadence and Synopsys will give technical presentations.

Global Participation

The OIP Forum will be held in six regions, including the United States, Japan, Taiwan, China, Europe, and Israel, and participation is expected from 750 companies and over 6,000 attendees.