Huida GTC Conference launches “super chip” French media reporter: AI overlord will be difficult to replace in a short time | Technology | Central News Agency CNA
2024/3/19 08:41 (updated at 3/19 10:42) Huida CEO Jen-Hsun Huang announced the launch of the next-generation AI chip Blackwell at the GTC conference, which is built using TSMC’s 4-nanometer process technology. He also took out the previous-generation Hopper chip and said, “Hopper is great, but we need a larger GPU.” This caused The whole crowd […]
The outside world at Huida GTC Conference is paying attention to the details of the new generation of AI chips | Technology | Central News Agency CNA
2024/3/18 14:04 (updated at 3/18 14:16) Huida CEO Huang Renxun will deliver a keynote speech on the first day of the GTC conference. He is expected to announce details of the next-generation AI chip B100, which will affect the future layout of the AI industry. This physical event, which has not been held for five […]
Samsung Electronics Introduces ‘3D Packaging Technology’ to Chase Rival TSMC
Samsung Electronics Introduces Groundbreaking 3D Packaging Technology As the demand for advanced semiconductors continues to grow, Samsung Electronics is poised to take the lead with its innovative ‘3D packaging technology’. This cutting-edge technology involves stacking different types of chips vertically to operate as a single chip, offering new possibilities for semiconductor manufacturing. What is 3D […]
