[비즈니스포스트] Evaluation means that as SK Hynix establishes a high-bandwidth reminiscence (HBM) expertise alliance with Taiwan’s TSMC, it would turn into more durable for Samsung Electronics to maintain up.
SK Hynix is anticipated to use TSMC’s FinFET course of to fabricate the HBM4 logic die to dramatically improve energy effectivity and cut back knowledge congestion.
Nevertheless, Samsung Electronics can be making an enormous effort to develop next-generation HBM expertise, and is anticipated to see a possibility to counterattack as it could possibly create synergy with foundry (semiconductor load manufacturing).
In response to a semiconductor business report on the twenty sixth, if SK Hynix and TSMC have a steady manufacturing system for HBM4, SK Hynix’s HBM market dominance is anticipated to be additional confirmed in 2025.
HBM is a reminiscence semiconductor that innovatively will increase knowledge processing velocity over present DRAM by connecting a number of DRAMs vertically. By stacking a number of DRAMs, a a lot greater capability per base space will be achieved, which makes it potential to course of giant quantities of information.
HBM is a construction the place a number of DRAMs are linked vertically on a logic die, and SK Hynix entrusts logic die manufacturing to TSMC beginning with HBM4, the sixth era HBM.
Logic die is a controlling a part of HBM, and to this point, SK Hynix has produced it instantly, nevertheless it doesn’t but have the expertise and gear to provide an revolutionary logic die that applies microprocessing.
TSMC introduced that it’ll use the 5-nano course of, a cutting-edge course of, together with a 12-nano course of to provide the HBM4 logic die.
With SK Hynix and TSMC becoming a member of palms, HBM’s efficiency is anticipated to enhance vastly.
Kim Gwi-wook, head of the HBM superior expertise staff at SK Hynix, participated within the Worldwide Reminiscence Workshop (IMW) 2024 on the thirteenth and stated, “The ability effectivity of HBM4 can be improved by 30% in comparison with its predecessor , HBM3E ,” and “the bandwidth will improve 1.4 instances and the mixing density 1.3 instances.”
Energy effectivity will be improved by as a lot as 30% due to the superior logic die. The outdated logic die accounted for 40% of the overall energy consumption of HBM, however by making use of the superior logic die, the ability consumption will be considerably diminished.
When energy consumption is diminished, it turns into simpler to manage warmth era, and knowledge congestion can be dramatically diminished.
Noh Geun-chang, a researcher at Hyundai Motor Securities, predicted, “Because the variety of phases of the HBM single stack will increase, logic die microprocessing will turn into vital to enhance energy consumption effectivity, so the partnership with TSMC will additional improve. SK Hynix’s technological superiority.”
The technological alliance between SK Hynix, the HBM powerhouse, and TSMC, the foundry powerhouse, is certain to be a serious risk to Samsung Electronics.
It is because Samsung Electronics is at present falling behind SK Hynix in HBM3E and TSMC within the 3nm foundry course of and under.
As well as, since TSMC is chargeable for your entire manufacturing of NVIDIA’s AI semiconductor load, SK Hynix’s HBM4 could also be extra advantageous in connecting HBM and GPU.
On the twenty second, Samsung Electronics modified the pinnacle of its DS division from President Gyeong-hyeon to Vice Chairman Jeon Younger-hyun, not directly admitting that it has didn’t actively reply to current adjustments within the semiconductor business .
Vice Chairman Jeon Younger-hyun is claimed to be planning to speculate closely in new next-generation HBM expertise and strengthen manpower to make up for lagging behind within the HBM market. The previous vice chairman is a former reminiscence engineer, and in contrast to the conservative administration of the previous, he’s identified to prioritize the proactive growth of recent applied sciences and technological competitiveness.
Samsung Electronics has at present established a devoted staff to develop HBM4 inside its reminiscence division and is devoting company-wide capabilities to regaining HBM management.
As well as, it’s anticipated to actively use the benefit of with the ability to present ‘whole AI options’ from foundry, packaging and reminiscence semiconductors. If the yield of the Cheomdam foundry course of is elevated, the transferring distance of components will be diminished and manufacturing effectivity will be maximized by instantly producing HBM4 logic dies.
Jinman Han, Vice President of DS Division Americas (DSA), stated at CES202 in January this 12 months, “Not too long ago, because the demand for reminiscence for accelerators equivalent to HBM will increase, startups combining with foundries are coming to the apparent.” “The convergence of reminiscence and foundries can have a ripple impact “The one firm that has it’s Samsung Electronics,” he stated. Reporter Na Byeong-hyun
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