Supermicro Expands Open Compute Project Portfolio for AI Data Centers
- announced an expanded portfolio of Open Compute Project Accepted systems, racks, and rear door heat exchangers on October 13, 2026, in San Jose, California, according to ir.supermicro.com.
- The updated portfolio includes ORv3 and ORW racks that replace standard per-server power supplies with a centralized 48-volt direct current busbar.
- Additional hardware options span the AMD Helios platform for high-volume inference, a 2OU four-node rack-scale architecture capable of housing Arm AGI CPUs, and a 250-kilowatt 4U in-rack cooling...
Super Micro Computer, Inc. announced an expanded portfolio of Open Compute Project Accepted systems, racks, and rear door heat exchangers on October 13, 2026, in San Jose, California, according to ir.supermicro.com. The hardware bundle targets rack-scale AI and high-performance computing data centers through the company’s Data Center Building Block Solutions framework.
Hardware Specifications and Rack Architecture
The updated portfolio includes ORv3 and ORW racks that replace standard per-server power supplies with a centralized 48-volt direct current busbar. These 21-inch racks feature a 5,000-pound certified static load capacity and accommodate various hardware configurations. Among the offerings is the 1OU FlexTwin solution, built with 2-node systems running Intel Xeon 6 or AMD EPYC processors. Supermicro also integrated the NVIDIA Vera Rubin NVL72 platform alongside a 2OU NVIDIA HGX B300 node layout that supports up to 18 nodes and 144 GPUs per rack.
Additional hardware options span the AMD Helios platform for high-volume inference, a 2OU four-node rack-scale architecture capable of housing Arm AGI CPUs, and a 250-kilowatt 4U in-rack cooling distribution unit.
Cooling Systems and Software Management Integration
Thermal management relies on DLC-2 Direct-to-Chip liquid cooling and purpose-built rear door heat exchangers spanning 10 kilowatts to 120 kilowatts of capacity. The cooling stack uses specialized dielectric fluids including DLC-1 and DLC-2 coolants aligned with OCP standards.
Company executives tied the hardware expansion directly to surging industry demand. The AI boom is redefining how data centers are designed, built, and deployed, and Supermicro is leading this transformation with DCBBS,
Charles Liang, president and chief executive officer of Supermicro, said in the announcement published by ir.supermicro.com. Dirk Van Slyke, vice president of marketing at the Open Compute Project, added that operators require open, flexible infrastructure capable of scaling alongside evolving workloads.
Summit Exhibition Schedule and Availability
The hardware suite debuted publicly at booth number B4 during the Open Compute Project Global Summit, running from October 12 through October 15, 2026, in San Jose. ir.supermicro.com confirmed that the expanded portfolio of OCP-accepted systems is available for customer deployment.
By bringing OCP-accepted systems, racks, power and cooling together in validated rack-scale solutions, Supermicro is helping customers simplify integration, maximize facility capacity and efficiency, and accelerate the deployment of production AI infrastructure.
Dirk Van Slyke