WASHINGTON – A nascent geopolitical alignment, dubbed a “big beautiful belt” by U.S. President Donald Trump, is solidifying across Eurasia, with a focus on states not traditionally considered core allies of the United States. The initiative, formalized through the newly established “Board of Peace,” is drawing attention for its composition and potential implications for global power dynamics and, increasingly, the semiconductor industry.
The Board of Peace, which held its inaugural meeting in Davos, Switzerland on January 23, 2026, represents a deliberate shift in U.S. Foreign policy. Rather than relying on established alliances in Western Europe and East Asia, the Trump administration is cultivating relationships with middle powers within the Eurasian interior. This strategy, as highlighted by reports from Nikkei Asia, suggests a recalibration of U.S. Priorities and a willingness to forge new partnerships outside of conventional frameworks.
The initial focus of the Board of Peace is Gaza reconstruction, with the inaugural meeting centered on fundraising efforts. However, the scope of the initiative appears to be expanding beyond humanitarian aid. Recent developments indicate the U.S. Is actively seeking to integrate member states of the Board of Peace into a “Pax Silica” chip coalition. This suggests a broader ambition to leverage these relationships for strategic economic advantage, particularly in the critical semiconductor sector.
The composition of the Board of Peace is notable for its exclusion of key U.S. Allies. This deliberate omission raises questions about the future of traditional alliances and the potential for a fracturing of the established international order. While the specific criteria for membership remain undisclosed, the focus on Eurasian middle powers suggests a preference for states willing to align with U.S. Interests without the constraints of long-standing commitments or obligations.
The “big beautiful belt” concept, as articulated by President Trump, envisions a network of U.S.-aligned states stretching across Eurasia. The formation of the Board of Peace represents a concrete step towards realizing this vision, providing a platform for regular dialogue and cooperation. The upcoming meeting in Washington, scheduled for Thursday, February 20, 2026, will likely serve as a further demonstration of U.S. Commitment to this new geopolitical alignment.
The move to incorporate Board of Peace members into the Pax Silica chip coalition underscores the growing importance of semiconductors in global power dynamics. The U.S. Is seeking to secure its supply chain and maintain its technological leadership in this critical sector, and the Eurasian states represented on the Board of Peace may offer access to resources, manufacturing capabilities, or strategic locations that are valuable to this effort.
The implications of this shift in U.S. Foreign policy are far-reaching. The cultivation of relationships with Eurasian middle powers could provide the U.S. With new avenues for influence and leverage in a region that is increasingly contested by other major powers, including China and Russia. However, it also carries the risk of alienating traditional allies and creating new tensions in the international system.
The focus on Gaza reconstruction as the initial priority of the Board of Peace suggests a desire to demonstrate U.S. Commitment to humanitarian concerns. However, the simultaneous pursuit of strategic economic objectives, such as the Pax Silica chip coalition, indicates that the initiative is driven by a complex interplay of geopolitical and economic considerations.
The success of the Board of Peace will depend on a number of factors, including the willingness of member states to cooperate with U.S. Objectives, the ability of the U.S. To provide tangible benefits in return for their alignment, and the broader geopolitical context. The upcoming meeting in Washington will be a crucial test of the initiative’s viability and its potential to reshape the landscape of U.S. Foreign policy.
Analysts will be closely watching for details emerging from the Washington meeting regarding specific commitments from Board of Peace members, particularly concerning the Pax Silica chip coalition. The extent to which these states are willing to integrate their semiconductor industries with U.S. Efforts will be a key indicator of the initiative’s long-term prospects.
The emergence of the “big beautiful belt” and the Board of Peace represents a significant departure from traditional U.S. Foreign policy. It signals a willingness to embrace new partnerships and pursue strategic objectives outside of established frameworks. The coming months will be critical in determining whether this new approach will prove successful in advancing U.S. Interests and shaping the future of the international order.
