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The United States and Japan, which have joined forces with advanced semiconductor technology, will create a roadmap to strengthen cooperation

Japan’s Economy, Trade and Industry Minister Yasutoshi Nishimura (left) and US Commerce Secretary Gina Ramondo / Reuters = Yonhap News

The United States and Japan have agreed to create a road map to strengthen technological cooperation in the field of high-tech semiconductors.

According to a report by the Nihon Keizai Shimbun on the 27th, Japanese Economy, Trade and Industry Minister Yasutoshi Nishimura and US Commerce Secretary Gina Lamondo will draw up a road map to strengthen technological cooperation in the semiconductor field after a meeting held in Detroit on the 26th (local time) A joint statement was issued.

The joint statement included providing a road map for technology development and human resource development in the high-tech semiconductor field and not relying on the supply of semiconductors in a particular region. In addition, the United States and Japan have also agreed to promote cooperation in artificial intelligence (AI) and biotechnology, such as joint research on new technologies and the exchange of human resources.

Nishimura Jingshan visited the United States to attend the Asia-Pacific Economic Cooperation (APEC) Trade Ministers’ Meeting and held talks with Chinese Trade Minister Wang Wentao on the 26th as an opportunity to attend the APEC Trade Ministers’ Meeting. After the meeting of the trade ministers between China and Japan, held after about three and a half years, he said, “We share the perception that it is important to have an honest dialogue even though there are pending issues.”