(Reuters) – Apple Inc plans to use Taiwan Semiconductor Manufacturing Co’s (TSMC) latest chip manufacturing technology update to produce iPhones and MacBooks next year, Nikkei Asia reported on Thursday.
The A17 mobile processor currently in development will be mass-produced using TSMC’s semiconductor manufacturing technology “N3E.” The N3E will be available in the second half of next year. This was reported, citing multiple sources.
The A17 is expected to be installed in the premium entry-level model of the iPhone, which is scheduled for release next year.
Apple declined to comment. TSMC could not be reached for comment.